BASF has developed a new polyphthalamide (PPA) material which it says is suitable for connectors post-processed with surface mount technology (SMT).
Ultramid® Advanced N grade, which is available with short-glass, long-glass or carbon fiber reinforcement, has high flowability, toughness and flame retardancy, BASF says, enabling miniaturization with thin-wall structures at high power and data throughput in electronic applications. Due to its low moisture uptake and high heat deflection temperature, the grade is also suitable for surface-mount technology (SMT) processes in electronics manufacturing as it can prevent blistering or changes in dimensions of the processed part, meeting the heat distortion temperature above 260°C.
‘Smaller and thinner parts have to be incorporated into even more compact designs to save assembly space while at the same time the power and data flow rates increase,’ said Ivy Fang, head of business development Asia for PPA at BASF. ‘Thus, the requirements on materials used grow, especially with respect to temperature and mechanical properties.’
BASF says that the new high-flow has a V-0 rating at 0.2mm (UL94) and satisfies JEDEC Level 1 blistering test standards. The material with a comparative tracking index (CTI) of 600 V also shows insulating properties in presence of humidity and chemicals.
This story uses material from BASF, with editorial changes made by Materials Today. The views expressed in this article do not necessarily represent those of Elsevier.