Hexcel has developed a new low temperature fast cure adhesive film.
According to the company, HexBond 679 250 gsm supported epoxy adhesive film is suitable for bonding sandwich structures, and offers cycle time reductions with its short-cure cycles at low temperatures in four hours at 80°C/176°F or eight hours at 70°C/158°F.
The films provide high lap shear and peel strength performance, and have a shelf-life of up to six weeks at 23°C. It is compatible with the HexPly M79 prepreg range, Hexcel said.
Both HexPly M79 prepregs and HexBond 679 adhesive films are formulated to meet the low temperature curing requirements of marine and other industrial manufacturers, allow boatbuilders to increase build rates with reduced heating and cooling times. They also allow uni-directional (UD) carbon tapes to be laminated with reduced debulking steps to produce void contents <1% irrespective of laminate thickness, the company said.
HexBond 679 adhesive film has also received DNV-GL Type approval.
This story uses material from Hexcel, with editorial changes made by Materials Today. The views expressed in this article do not necessarily represent those of Elsevier.
