Resin designed for surface mount connectors

The material delivers high flow, flatness, and dimensional stability for new 12-gigabyte connectors that target applications in desktop and laptop computers, as well as tablets.

“The connector industry’s adoption of advanced fine-pitch technology has placed even more exacting demands on materials,” said Glenn Cupta, global business development manager for electrical/electronics at Solvay Specialty Polymers. “Xydar MG-850 LCP offers manufacturers exceptional performance for these next-generation connectors, providing even tighter tolerances and lower warpage compared to our standard LCP material.”

Improved warp resistance

Xydar MG-850 LCP is a 50 percent glass/mineral reinforced polymer that fills thin walls over long flow lengths. The mineral and glass reinforcement package reportedly has improved warp resistance. It also exhibits a heat deflection temperature of 271°C (520°F) and infrared reflow capability up to 260°C (500°F). The material’s low moisture absorption facilitates improved IR reflow performance, according to Cupta.

Thenew injection moldable grade offers performance advantages over competitive low-warp LCPs, and doesn’t suffer from corrosion issues exhibited by other rival material technologies, such as halogen-free flame retardant polyphthalamide (PPA) resins. Xydar LCP is inherently flame retardant, transparent to microwave radiation and resistant to virtually all chemicals. The material has an UL 94 V0 flammability rating from Underwriters Laboratories of 0.2 mm without additives.