Low viscosity epoxy for medical electronic applications

Master Bond has developed a biocompatible two part epoxy with a mixed viscosity of 150-300 cps that has been formulated for medical electronic applications. Master Bond EP62-1LPSPMed has ultra low viscosity which makes it suitable for use in underfill, impregnation and porosity sealing applications, as well as bonding, coating or encapsulation, the company said. This product exhibits improved wetting properties and can flow by capillary action in tight clearances or beneath devices. It adheres well to metals, plastics, composites, polyimides, glass and ceramic substrates.

EP62-1LPSPMed has a working life of 12-24 hours for a 100 gram mass and requires moderate heat for curing. Cure schedule is overnight at room temperature followed by 60-90 minutes at 80-100°C.

Master Bond EP62-1LPSPMed passes USP Class VI and ISO 10993-5 cytotoxicity requirements. It also has been tested for 1,000 hours at 85°C/85% RH. It has improved toughness, tensile strength of 11,000-12,000 psi and resists repeated cycles of ethylene oxide, radiation, and chemical sterilization. This compound has volume resistivity of more than 1014 ohm-cm, withstands mechanical shock/vibration and is serviceable from 4K to +400°F. In very thin sections it will transmit light, but in thicker sections it is opaque. Shore D hardness is 75-85 and its glass transition temperature is 125-130°C.

This story uses material from Master Bondwith editorial changes made by Materials Today. The views expressed in this article do not necessarily represent those of Elsevier.