Master Bond says that its UV22DC80-1Med epoxy passes USP Class VI Tests for biocompatibility and meets ISO 10993-5 for cytotoxicity, making it suitable for many applications in the medical device industry. The single component, nanosilica filled compound features a UV and heat curing mechanism. Master Bond says that it offers low shrinkage upon cure and improved abrasion resistance and dimensional stability with a low coefficient of thermal expansion 30-35 x 10-6 inch/inch/°C. It is a electrical insulator with volume resistivity of more than 1014 ohm-cm and dielectric constant of 3.85 at 60 Hz. UV22DC80-1Med is optically clear with refractive index of 1.52. The UV curing process for UV22DC80-1Med takes 10-30 seconds at a 365 nm wavelength and 10-40 mW/cm2 of UV output. The heat curing process can be initiated at 80°C, while optional post curing at 125-150°C for 15-30 minutes will increase the glass transition temperature to over 125°C. The system is not oxygen inhibited. UV22DC80-1Med has a low viscosity of 500-3,500 cps at 75°F (~23°C) and can bond to a variety of substrates including metals, glass, ceramics and most plastics.
This story uses material from Master Bond, with editorial changes made by Materials Today. The views expressed in this article do not necessarily represent those of Elsevier.