Epoxy suitable for bonding

Master Bond says developed a new single component epoxy which it says is suitable for glob top, chip coating and bonding applications.

EP17HTND-CCM is not premixed and frozen and is reportedly more convenient to handle, apply and store than typical two component glob top systems. It meets NASA low outgassing specifications and is serviceable from -80°F to +600°F [-62°C to +316°C].

EP17HTND-CCM is thermally conductive and electrically non-conductive even upon exposure to hostile environmental conditions, Master Bond says. It cures in 1-2 hours at 350°F (175°C) with a relatively low exotherm upon curing.

This story is reprinted from material from Master Bond, with editorial changes made by Materials Today. The views expressed in this article do not necessarily represent those of Elsevier.